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NCP3488
MAXIMUM RATINGS
Operating Ambient Temperature, T A
Operating Junction Temperature, T J (Note 1)
Package Thermal Resistance: SO ? 8
Junction ? to ? Case, R q JC
Junction ? to ? Ambient, R q JA (2 ? Layer Board)
Storage Temperature Range, T S
Rating
Value
0 to 85
0 to 150
45
123
? 65 to 150
Unit
° C
° C
° C/W
° C/W
° C
Lead Temperature Soldering (10 sec): Reflow (SMD styles only)
JEDEC Moisture Sensitivity Level
Pb ? Free (Note 3)
(260 peak profile)
260 peak
1
° C
?
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Internally limited by thermal shutdown, 150 ° C min.
2. 2 layer board, 1 in 2 Cu, 1 oz thickness.
3. 60 ? 180 seconds minimum above 237 ° C.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
MAXIMUM RATINGS
Pin Symbol
V CC
BST
SW
DRVH
DRVL
IN
OD
PGND
Pin Name
Main Supply Voltage Input
Bootstrap Supply Voltage Input
Switching Node
(Bootstrap Supply Return)
High ? Side Driver Output
Low ? Side Driver Output
DRVH and DRVL Control Input
Output Disable
Ground
V MAX
15 V
30 V wrt/PGND
35 V v 50 ns wrt/PGND
15 V wrt/SW
30 V
BST + 0.3 V
35 V v 50 ns wrt/PGND
15 V wrt/SW
V CC + 0.3 V
V CC + 0.3 V
V CC + 0.3 V
0V
V MIN
? 0.3 V
? 0.3 V wrt/SW
? 1.0 V DC
? 10 V< 200 ns
? 0.3 V wrt/SW
? 0.3 V DC
? 2.0 V < 200 ns
? 0.3 V
? 0.3 V
0V
NOTE:
All voltages are with respect to PGND except where noted.
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